Qualcomm announces 5G enabled Snapdragon 865, 765/765D, and a new 3D Sonic Max fingerprint scanner

We usher to the age of the next telecommunication technology standards, What I mean to say is that 5G is creeping out from the bag and into every mobile users hands. The foundation is already there but few have fully embraced the technology. But that hopes to change as Qualcomm introduces its next generation chipsets that would leverage the technology.

At the Qualcomm annual Summit, the company introduces their next-gen top of the line mobile chipset the modular-designed Snapdragon 865 and two mid-rangers the Snapdragon 765 and Snapdragon 765D which all comes 5G support.

While these new and shiny Qualcomm Snapdragon SoC’s have integrated 5G in them, it also has tools for carriers which allows it to easily implement their own preferred 5G technologies to the new chipset.

The Snapdragon 865 chipset for instance can be paired with the new X55 modem which has a more power efficient process compared to its predecessor. The new X55 modem features a higher upload and download speeds, supports SA/NSA networks and support for both mmWave and Sub-6 GHz 5G networks with improved bandwidth.

Besides the new chipsets, Qualcomm also announced a new in-display fingerprint scanner technology called the 3D Sonic Max. What it does is that it makes a wider area for fingerprint scanning and also supports two simultaneous fingerprint authentication reading with the accuracy vastly improved.

These new chipsets and new features from Qualcomm are all expected on next year’s mobile devices and we are very much excited on what the next devices could do with these new components.